GIGABYTE have unveiled the latest additions to their motherboard line-up at CES 2026. Designed to unlock the full performance potential of AMD Ryzen 9000 Series Processors, the flagship X870E AORUS XTREME X3D AI TOP sets the new standard for AI-assisted performance. Benefitting from access to Gigabytes AI-powered X3D Turbo Mode 2.0, when paired with the X3D AI TOP motherboard (or other Turbo Mode 2.0 compatible Gigabyte motherboards), X3D CPUs are able to be pushed beyond traditional limits, thanks to adaptive performance tuning. The technology is trained using real-world data sets with a view to being a true hardware to software fusion. Turbo Mode 2.0 is fully optimized for AMD’s latest Ryzen 9000 Series X3D CPUs, offering immediate benefits without the need for manual tuning.
At the forefront of the breakthrough is the X870E AORUS XTREME X3D AI TOP, an enthusiast grade motherboard, built for users seeking uncompromised performance. Supporting DDR5 memory speeds of up to 9000+ MT/s and featuring an advanced thermal design aimed at maintaining stability under extreme workloads, users can expect a reduction in VRM and memory temperatures by up to 9°C. M.2 SSD storage also receive boosts to thermal performance, thanks to the M.2 Thermal Guard XTREME, responsible for reducing SSD temperatures by up to 22°C.
Alongside performance-focused hardware, GIGABYTE also highlighted a growing emphasis on design and builder experience. The X870E AERO X3D WOOD introduces wood-grain textures and refined leather pull tabs, blending natural materials with high-end PC components to appeal to style-conscious builders and offer the first true motherboard tie-in to the wooden accent case aesthetic.
The PROJECT STEALTH line-up is also set to receive new additions in the form of X870 and B850 AORUS STEALTH motherboards. Featuring a reverse-connector layout, PROJECT STEALTH boards are designed to eliminate visible cabling, delivering a cleaner aesthetic and a simpler assembly process for gamers and creators alike.


